Hottest heat shrinkable laminated film and package

2022-07-26
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The heat shrinkable laminated film and the packaging body formed by it

[patent name: the processed gap has excellent identity] the heat shrinkable laminated film and the packaging body formed by it

[applicant] Co., Ltd. Wuyu

[inventor] kaumura Yazhi; Pacific Ocean; Inaba Youce; Yingming Tanaka

[address of main applicant] Tokyo, Japan

[application No.] 4

[application date] 2004.04.26

[approval Announcement No.]

[approval announcement date] 2006.05.24

[main classification No.] b32b27/30 (2006.01) i

[classification No.] b32b27/30 (2006.01) I c08j7/04 (2006.01) i

[priority item] 2003.4.25 JP 123004/2003

[main right to fresh-keeping] 1 A heat shrinkable laminated film has at least one pair of layers (a) adjacent to the layer (b) on at least one surface of the heat shrinkable support film (base material film), the layer (a) contains a polycarboxylic polymer (a), the layer (b) contains a multivalent metal compound (b), and its heat shrinkage is 3-90%

[instruction CD No.] d

[international application] what is the structure of pct/jp2004/005995

[international publication] wo2004/096540

[Abstract] the invention aims to provide a heat shrinkable laminated film, which comprises: a layer containing a polycarboxylic polymer, a layer containing a multivalent metal compound, and a heat shrinkable support film. The heat shrinkable laminated film has at least one pair of layers (a) adjacent to layer (B) on at least one surface of the heat shrinkable support film (base material film), The layer (a) contains a polycarboxylic polymer (a), the layer (b) contains a multivalent metal compound (b), and the heat shrinkage rate is 3 ~ 90%. The invention also provides a package body and a heat shrinkage label that use the heat shrinkable laminated film to package the package

[agent] Beijing zhongzi sub grade expansion refers to a partial parameter of the sensor amplifier law firm

[agent] Duan Chengen Tianxin

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